Other
Application
Process Support
Precision Engineering
Production Equipment
Flip Chip Bonder
Photonics
Manual Die Bonder
Automated Die Bonder
Eutectic Bonding
Epoxy Bonding
High Power Laser Bonding
Si Photonics
Chip On Submount Assembly
Smd Rework
Sensor Assembly
Detector Bonding
Optical Transceiver Assembly
Finetech is a leading global supplier of micro assembly and professional SMD rework equipment for customers involved in the development and manufacturing of opto- and microelectronics. Finetech’s die bonder systems, with up to 0.3 micron placement accuracy, support a wide range of advanced bonding technologies to implement the most precise and complex applications.
Finetech follows the “Prototype-to-Production” approach to support customers at the development stage and help them transition their processes into production. This makes Finetech equipment the perfect fit for flexible and cost-efficient product development and manufacturing.
The company serves a broad range of industries, including Datacom & Telecom, Industrial Semiconductor, Consumer Electronics, Medical, Aerospace & Avionics, Automotive, Defense & Security, Energy, as well as universities and research facilities. With subsidiaries on three continents and a global network of representatives, Finetech ensures quick response times, fast on-site service and personal consultation